In the old days, stress was the bane of your existence in packaging. That’s still there. One of the biggest challenges in new single-die and multi-die packages is warpage. Unfortunately, silicon has a coefficient of thermal expansion of around 2. That’s 2 parts per million of expansion for every degree C that it heats up or cools.
All of the organic materials that we use around it are 10 or larger. When they are in intimate contact with one another in a package, and it is heated or cooled, you are expanding and contracting differentially, depending on where you are in the stack. That’s make things move out of plane. There is no such thing as a flat package. It has some sort of warpage or curvature to it. It may not be visible to the eye, but it’s always there. And that adds stress, too.
Warpage is something we have to manage. We have good tools - Wafer warpage control film for managing this problem these days. We have a many better film materials selection than we did 6 years ago. It’s getting easier to manage warpage for different warpage.
● Independent research and manufacure in Taiwan
● Can control any wafer warpage for RDL process.
● Excellent laser marking quality.
● Excellent adhesion performance with metal and glass .
● Excellent heat dissipation.
● Application for Infrared (IR) Transmission inspection of wafer backside.
● Can Customize film feature i.e. magnetic, transparent...etc.
● Eco-friendly, do not contain toluene
Product Structure:
Width:
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging, Heterogeneous Integration
https://www.applichem.com.tw/news-detail-3128122.html
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