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| TBF-GL | TBF-M | Other (S) | Other (A) | |
| Thicknesses [μm] | 20-150 | 20-150 | >20 | - |
|---|---|---|---|---|
| CTE (25-150°C) [ppm/°C] | 16 | 20 | 24.5 | 39 |
| CTE (150-240°C) [ppm/°C] | 62 | 42 | 70 | 117 |
| Dk (10GHz) | 3.2 | 3.2 | 3.3(5.8GHz) | 3.2(5.8GHz) |
| Df (10GHz) | 0.003 | 0.013 | 0.009(5.8GHz) | 0.018(5.8GHz) |
| Tensile Strength [MPa] | 40 | 51 | 100 | 98 |
| Young’s Modulus [GPa] | 6.6 | 6.0 | 8.0 | 5.0 |
| Tg (DMA) [°C] | 187 | 190 | 205 | 168 |
| Elongation [%] | 0.8 | 1.4 | 2.4 | 5.6 |
| Flame Retardant (UL94) | V0 | V0 | V0 | V0 |
Find more information on WaferChem website
https://www.applichem.com.tw/news-detail-3307449.html
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