晶化科技waferchem

半導體先進封裝英文術語 大解析

Acronyms 英文術語

• IC : Integrated Circuit
• ABF : Ajinomoto Build-up Film
• SLP : Substrate-Level Printed
• ED : Embedded Die
• CAGR : Compound Annual Growth Rate
• AP : Advanced Packaging
• FC CSP : Flip-Chip Chip Scale Packaging
• HPC : High-Performance Computing
• GPU : Graphics Processing Units
• FC BGA : FC Ball Grid Array
• SAP : Semi Additive Processes
• mSAP : modified SAP
• amSAP : advanced mSAP
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• 國產半導體材料領頭羊-晶化科技提供

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