晶化科技waferchem

● Independent research and manufacture in Taiwan

●World position: NO.1 in Taiwan, NO.3 in the world

● Copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.

● Can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.

● Excellent adhensive performance, chemical resistance and grinding material.

● Low CTE to reduce package warpage 

● Low Dk & Df  

● Preservation condition better than Japan Brand  (0-5 degreeC  6 Months )

● Eco-friendly, do not contain toluene (Pass RoHS)

● Lead time short and sufficient capacity

https://www.applichem.com.tw/news-detail-3276173.html