晶化科技waferchem

USE "Wafer Warpage Control Film" 

Stress and warpage
The mismatch of CTE between silicon, polyimide (in RDL), and epoxy molding compound creates warpage problems. Warpage leads to yield loss.

“Warpage is definitely a problem. That’s why a lot of the individuals are moving to the compression molding and the bottom gated, compression molding versus the top system,” said Greely.

Another way to reduce stress and warping is by selecting better dielectric material with lower cure temperatures.

Wafer Warpage Control Film

● Independent research and manufacure in Taiwan 

● Can control any wafer warpage for RDL process. 

● Excellent laser marking quality.

● Excellent adhesion performance with metal and glass .

● Excellent heat dissipation.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

https://www.applichem.com.tw/news-detail-3276701.html